ELECTRONICS COMPONENTS SUPPLIES

BALL GRID ARRAY CONNECTOR SERIES
PIN GRID ARRAY SOCKET
• Contact Material: Brass.
• Insulator Material: Black Polyester UL94V-0.
• Operating Temperature:-55oC to +105oC.
• Soldering Temperature: +260oC, 10s Max.
• Pitch: 2.54mm x 2.54mm, 2.54mm x 1.27mm.

MICRO PIN GRID ARRAY SOCKET
• Contact Material: Brass.
• Insulator Material: Black Polyester UL94V-0.
• Operating Temperature:-55oC to +105oC.
• Soldering Temperature: +260oC, 10s Max.
• Pitch: 12.7mm x 12.7mm.
SOLDER TAILS PIN ARRAY SOCKET
• Contact Material: Brass.
• Insulator Material: Black Polyester UL94V-0.
• Operating Temperature:-55oC to +105oC.
• Soldering Temperature: +260oC, 10s Max.
• Pitch: 2.54mm x 2.54mm, 2.54mm x 1.27mm.